Taylor & Francis

Physical Design for 3D Integrated Circuits - Paperback / softback

Edition: 1st Edition
Subjects: Engineering, Technology, engineering, agriculture
ISBN13: 9780367778873
Published: 31 Mar 2021

Format - Paperback / softback
By Aida Todri-Sanial

The release of this order may delay up to 4-6 weeks due to congestion at publisher’s warehouse.

Regular price A$104.80
Sale price A$104.80 Regular price A$131.00

Physical Design for 3D Integrated Circuits - Paperback / softback

Regular price A$104.80
Sale price A$104.80 Regular price A$131.00
Product description
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology.The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference:

    Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs
    Supplies state-of-the-art solutions for challenges unique to 3D circuit design
    Features contributions from renowned experts in their respective fields
Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
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