Electronic Packaging Materials and Their Properties
Taylor & Francis

Electronic Packaging Materials and Their Properties

Edition: 1st Edition
Subjects: Engineering, Technology, engineering, agriculture
ISBN13: 9780849396250
Published: 18 Dec 1998

Format - Hardback
By Michael Pecht

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Regular price A$260.80
Sale price A$260.80 Regular price A$326.00

Electronic Packaging Materials and Their Properties

Regular price A$260.80
Sale price A$260.80 Regular price A$326.00
Product description
Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiationElectronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnection printed circuit board substrate encapsulant dielectric die attach material electrical contact thermal material solderElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.
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