McGraw Hill
MEMS/MOEM Packaging
Subjects: Engineering,
Electronics & communications engineering
ISBN13: 9780071455565
Format - BOOK
Usually ready in 7-10 business days.
Regular price
A$268.85
Sale price
A$268.85
Regular price
A$277.16
Product description
Shipping & Return
Author(s): Gilleo, Ken
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Review(s):
EAN: 9780071455565
Age Group:
Number of Pages: 240
Weight: 489.4 gr
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.
While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.
Review(s):
EAN: 9780071455565
Age Group:
Number of Pages: 240
Weight: 489.4 gr
Shipping cost is based on weight. Just add products to your cart and use the Shipping Calculator to see the shipping price.
We want you to be 100% satisfied with your purchase. Items can be returned or exchanged within 30 days of delivery.