{"product_id":"self-organized-3d-integrated-optical-interconnects-hardback","title":"Self-Organized 3D Integrated Optical Interconnects - Hardback","description":"\u003cp\u003eCurrently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE\/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. \u003c\/p\u003e\u003cp\u003eThis book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.\u003c\/p\u003e","brand":"Taylor \u0026 Francis","offers":[{"title":"Default Title","offer_id":45576009973998,"sku":"9789814877046","price":195.2,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0630\/9612\/7726\/files\/9789814877046.jpg?v=1720962947","url":"https:\/\/bookland.com.au\/products\/self-organized-3d-integrated-optical-interconnects-hardback","provider":"Book Land AU","version":"1.0","type":"link"}