{"product_id":"power-integrity-modeling-and-design-for-semiconductors-and-systems","title":"Power Integrity Modeling and Design for Semiconductors and Systems","description":"\u003cp\u003eProfessionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.\u003c\/p\u003e \u003cp\u003eUsing realistic case studies and downloadable software examples, two leading experts demonstrate today's best techniques for designing and modeling interconnects to efficiently distribute power and minimize noise.\u003c\/p\u003e \u003cp\u003eThe authors carefully introduce the core concepts of power distribution design, systematically present and compare leading techniques for modeling noise, and link these techniques to specific applications. Their many examples range from the simplest (using analytical equations to compute power supply noise) through complex system-level applications.\u003c\/p\u003e \u003cp\u003eThe authors\u003c\/p\u003e \u003cul\u003e \u003cli\u003eIntroduce power delivery network components, analysis, high-frequency measurement, and modeling requirements\u003c\/li\u003e\n \u003cli\u003eThoroughly explain modeling of power\/ground planes, including plane behavior, lumped modeling, distributed circuit-based approaches, and much more\u003c\/li\u003e\n \u003cli\u003eOffer in-depth coverage of simultaneous switching noise, including modeling for return currents using time- and frequency-domain analysis\u003c\/li\u003e\n \u003cli\u003eIntroduce several leading time-domain simulation methods, such as macromodeling, and discuss their advantages and disadvantages\u003c\/li\u003e\n \u003cli\u003ePresent the application of the modeling methods on several advanced case studies that include high-speed servers, high-speed differential signaling, chip package analysis, materials characterization, embedded decoupling capacitors, and electromagnetic bandgap structures\u003c\/li\u003e\n \u003c\/ul\u003e \u003cp\u003eThis book's system-level focus and practical examples will make it indispensable for every student and professional concerned with power integrity, including electrical engineers, system designers, signal integrity engineers, and materials scientists. It will also be valuable to developers building software that helps to analyze high-speed systems.\u003c\/p\u003e","brand":"Pearson Education","offers":[{"title":"Default Title","offer_id":46286741733614,"sku":"9780132797177","price":112.14,"currency_code":"AUD","in_stock":true}],"url":"https:\/\/bookland.com.au\/products\/power-integrity-modeling-and-design-for-semiconductors-and-systems","provider":"Book Land AU","version":"1.0","type":"link"}