{"product_id":"modeling-and-design-of-electromagnetic-compatibility-for-high-speed-printed-circuit-boards-and-packaging","title":"Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging","description":"\u003cp\u003eModeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems.This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.\u003c\/p\u003e","brand":"Taylor \u0026 Francis","offers":[{"title":"Default Title","offer_id":44556707758318,"sku":"9780367573669","price":75.99,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0630\/9612\/7726\/files\/9780367573669_565c4d7e-0d58-4b84-bb2d-4d2eeaba65fb.jpg?v=1704950807","url":"https:\/\/bookland.com.au\/products\/modeling-and-design-of-electromagnetic-compatibility-for-high-speed-printed-circuit-boards-and-packaging","provider":"Book Land AU","version":"1.0","type":"link"}