{"product_id":"handbook-of-semiconductor-interconnection-technology-hardback","title":"Handbook of Semiconductor Interconnection Technology - Hardback","description":"\u003cp\u003eFirst introduced about a decade ago, the first edition of the \u003cstrong\u003eHandbook of Semiconductor Interconnection Technology\u003c\/strong\u003e became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the \"likely directions\" outlined in the first edition are now standard in modern facilities. Reflecting those advances, this edition delves into the practical aspects of interconnections for manufacturing. It examines the interconnect and fabrication technologies now available, with an examination of future prospects for the field.\u003cbr\u003e\u003cbr\u003e\u003cstrong\u003e\u003cem\u003eWhat's in this Edition:\u003c\/em\u003e\u003c\/strong\u003e\u003c\/p\u003e\u003cli\u003eDetailed discussion of electrochemical equipment for plating copper\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eInformation on tools used for evaporation, chemical vapor deposition, and plasma processes\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eEmphasis on measurement of mechanical and thermal properties of insulators\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eMethods for characterizing porous dielectric thin films\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eGreater focus on integration issues and properties of titanium, cobalt, and nickel silicides\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eProcess schemes based on the increased need for borderless contact gates and source\/drain\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eExpanded discussion on choices for low-dielectric insulators\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eConcentration on electroplated copper, especially morphology of plated films and their properties\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eDevelopments in thin film liners and barriers\u003cbr\u003e \u003c\/li\u003e\u003cli\u003eExpanded material on copper reliability\u003cbr\u003e \u003c\/li\u003e","brand":"Taylor \u0026 Francis","offers":[{"title":"Default Title","offer_id":45575720206574,"sku":"9781574446746","price":352.8,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0630\/9612\/7726\/files\/9781574446746.jpg?v=1720957541","url":"https:\/\/bookland.com.au\/products\/handbook-of-semiconductor-interconnection-technology-hardback","provider":"Book Land AU","version":"1.0","type":"link"}