{"product_id":"9780071848060","title":"3D IC Integration and Packaging","description":"\u003cb\u003eAuthor(s): Lau, John H.\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\n\n\u003cp\u003e\u003cspan\u003e\u003cb\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality,  \u003cspan\u003e    \u003c\/span\u003eauthenticity, or access to any online entitlements included with the product\u003c\/b\u003e.\u003cp\u003e\u003c\/p\u003e\u003c\/span\u003e\u003c\/p\u003e\u003cbr\u003e\u003cb\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003e\u003cbr\u003eA comprehensive guide to 3D IC integration and packaging technology\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\u003ci\u003e3D IC Integration and Packaging\u003c\/i\u003e fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003ci\u003e3D IC Integration and Packaging \u003c\/i\u003ecovers:\u003cbr\u003e\u003cbr\u003e\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003e3D integration for semiconductor IC packaging\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003eThrough-silicon vias modeling and testing\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003eStress sensors for thin-wafer handling and strength measurement\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003ePackage substrate technologies\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003eMicrobump fabrication, assembly, and reliability\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003e3D Si integration\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003e2.5D\/3D IC integration\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003e3D IC integration with passive interposer\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003eThermal management of 2.5D\/3D IC integration\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003eEmbedded 3D hybrid integration\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003e3D LED and IC integration\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003e3D MEMS and IC integration\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003e3D CMOS image sensors and IC integration\u003cbr\u003e\u003cspan\u003e• \u003c\/span\u003ePoP, chip-to-chip interconnects, and embedded fan-out WLP\u003cbr\u003e\n\n\u003cbr\u003e\u003cbr\u003eReview(s):\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eEAN: 9780071848060\u003cbr\u003e\u003cbr\u003eAge Group:  \u003cbr\u003e\u003cbr\u003eNumber of Pages: 480\u003cbr\u003e\u003cbr\u003eWeight: 1038.3 gr\u003cbr\u003e\u003cbr\u003e","brand":"McGraw Hill","offers":[{"title":"Hardback","offer_id":43845811929326,"sku":"9780071848060","price":297.65,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0630\/9612\/7726\/products\/3D-IC-Integration-and-Packaging-Book-Land-AU-276.jpg?v=1679296385","url":"https:\/\/bookland.com.au\/products\/9780071848060","provider":"Book Land AU","version":"1.0","type":"link"}