{"product_id":"9780071785143","title":"Through-Silicon Vias for 3D Integration","description":"\u003cb\u003eAuthor(s): Lau, John H.\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\n\n\u003ch4\u003e\u003c\/h4\u003e\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size:12.0pt;line-height:107%;font-family:\" times new roman\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, \u003cspan style=\"white-space:pre\"\u003e\u003c\/span\u003eauthenticity, or access to any online entitlements included with the product.\u003cp\u003e\u003c\/p\u003e\u003c\/span\u003e\u003c\/p\u003e\u003ch4\u003e\u003cbr\u003e\u003c\/h4\u003e\u003ch4\u003eA comprehensive guide to TSV and other enabling technologies for 3D integration\u003c\/h4\u003e\u003cp\u003eWritten by an expert with more than 30 years of experience in the electronics industry, \u003ci\u003eThrough-Silicon Vias for 3D Integration\u003c\/i\u003e provides cutting-edgeinformation on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.\u003c\/p\u003e\u003cp\u003eThis book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.\u003c\/p\u003e\u003cp\u003eCoverage includes:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eNanotechnology and 3D integration for the semiconductor industry\u003c\/li\u003e\n\u003cli\u003eTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing\u003c\/li\u003e\n\u003cli\u003eTSVs: mechanical, thermal, and electrical behaviors\u003c\/li\u003e\n\u003cli\u003eThin-wafer strength measurement\u003c\/li\u003e\n\u003cli\u003eWafer thinning and thin-wafer handling\u003c\/li\u003e\n\u003cli\u003eMicrobumping, assembly, and reliability\u003c\/li\u003e\n\u003cli\u003eMicrobump electromigration\u003c\/li\u003e\n\u003cli\u003eTransient liquid-phase bonding: C2C, C2W, and W2W\u003c\/li\u003e\n\u003cli\u003e2.5D IC integration with interposers\u003c\/li\u003e\n\u003cli\u003e3D IC integration with interposers\u003c\/li\u003e\n\u003cli\u003eThermal management of 3D IC integration\u003c\/li\u003e\n\u003cli\u003e3D IC packaging\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003c\/p\u003e\n\n\u003cbr\u003e\u003cbr\u003eReview(s):\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eEAN: 9780071785143\u003cbr\u003e\u003cbr\u003eAge Group:  \u003cbr\u003e\u003cbr\u003eNumber of Pages: 512\u003cbr\u003e\u003cbr\u003eWeight: 852.8 gr\u003cbr\u003e\u003cbr\u003e","brand":"McGraw Hill","offers":[{"title":"Hardback","offer_id":43845771985134,"sku":"9780071785143","price":244.4,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0630\/9612\/7726\/products\/9780071785143_f47dc8a2-7f39-44a4-9be3-0efb120f70ca.jpg?v=1671236209","url":"https:\/\/bookland.com.au\/products\/9780071785143","provider":"Book Land AU","version":"1.0","type":"link"}