{"product_id":"9780071753791","title":"Reliability of RoHS-Compliant 2D and 3D IC Interconnects","description":"\u003cb\u003eAuthor(s): Lau, John H.\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\n\n\u003ch4\u003e\u003c\/h4\u003e\u003cp class=\"MsoNormal\"\u003e\u003cspan style=\"font-size:12.0pt;line-height:107%;font-family:\" times new roman\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, \u003cspan style=\"white-space:pre\"\u003e\u003c\/span\u003eauthenticity, or access to any online entitlements included with the product.\u003cp\u003e\u003c\/p\u003e\u003c\/span\u003e\u003c\/p\u003e\u003ch4\u003e\u003cbr\u003e\u003c\/h4\u003e\u003ch4\u003eProven 2D and 3D IC lead-free interconnect reliability techniques\u003c\/h4\u003e\u003cp\u003e\u003ci\u003eReliability of RoHS-Compliant 2D and 3D IC Interconnects\u003c\/i\u003e offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.\u003c\/p\u003e\u003cp\u003eCovers reliability of:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003e2D and 3D IC lead-free interconnects\u003c\/li\u003e\n\u003cli\u003eCCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints\u003c\/li\u003e\n\u003cli\u003eLead-free (SACX) solder joints\u003c\/li\u003e\n\u003cli\u003eLow-temperature lead-free (SnBiAg) solder joints\u003c\/li\u003e\n\u003cli\u003eSolder joints with voids, high strain rate, and high ramp rate\u003c\/li\u003e\n\u003cli\u003eVCSEL and LED lead-free interconnects\u003c\/li\u003e\n\u003cli\u003e3D LED and 3D MEMS with TSVs\u003c\/li\u003e\n\u003cli\u003eChip-to-wafer (C2W) bonding and lead-free interconnects\u003c\/li\u003e\n\u003cli\u003eWafer-to-wafer (W2W) bonding and lead-free interconnects\u003c\/li\u003e\n\u003cli\u003e3D IC chip stacking with low-temperature bonding\u003c\/li\u003e\n\u003cli\u003eTSV interposers and lead-free interconnects\u003c\/li\u003e\n\u003cli\u003eElectromigration of lead-free microbumps for 3D IC integration\u003c\/li\u003e\n\u003c\/ul\u003e\n\n\u003cbr\u003e\u003cbr\u003eReview(s):\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eEAN: 9780071753791\u003cbr\u003e\u003cbr\u003eAge Group:  \u003cbr\u003e\u003cbr\u003eNumber of Pages: 640\u003cbr\u003e\u003cbr\u003eWeight: 1019.7 gr\u003cbr\u003e\u003cbr\u003e","brand":"McGraw Hill","offers":[{"title":"Hardback","offer_id":43845759369454,"sku":"9780071753791","price":219.96,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0630\/9612\/7726\/products\/9780071753791_baf89e7a-121b-4232-94e3-bd4e5dacd7bc.jpg?v=1671235487","url":"https:\/\/bookland.com.au\/products\/9780071753791","provider":"Book Land AU","version":"1.0","type":"link"}