{"product_id":"9780071741958","title":"3D IC Stacking Technology","description":"\u003cb\u003eAuthor(s): Wu, Banqiu, Kumar, Ajay, Ramaswami, Sesh\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\n\n\u003ch4\u003ePublisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, \u003cspan style=\"white-space:pre\"\u003e\u003c\/span\u003eauthenticity, or access to any online entitlements included with the product.\u003c\/h4\u003e\u003ch4\u003e\u003cbr\u003e\u003c\/h4\u003e\u003ch4\u003eThe latest advances in three-dimensional integrated circuit stacking technology\u003c\/h4\u003e\u003cp\u003eWith a focus on industrial applications, \u003ci\u003e3D IC Stacking Technology\u003c\/i\u003e offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.\u003c\/p\u003e\u003cp\u003e\u003ci\u003e3D IC Stacking Technology\u003c\/i\u003e covers:\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eHigh density through silicon stacking (TSS) technology\u003c\/li\u003e\n\u003cli\u003ePractical design ecosystem for heterogeneous 3D IC products\u003c\/li\u003e\n\u003cli\u003eDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stack\u003c\/li\u003e\n\u003cli\u003eProcess integration for TSV manufacturing\u003c\/li\u003e\n\u003cli\u003eHigh-aspect-ratio silicon etch for TSV\u003c\/li\u003e\n\u003cli\u003eDielectric deposition for TSV\u003c\/li\u003e\n\u003cli\u003eBarrier and seed deposition\u003c\/li\u003e\n\u003cli\u003eCopper electrodeposition for TSV\u003c\/li\u003e\n\u003cli\u003eChemical mechanical polishing for TSV applications\u003c\/li\u003e\n\u003cli\u003eTemporary and permanent bonding\u003c\/li\u003e\n\u003cli\u003eAssembly and test aspects of TSV technology\u003c\/li\u003e\n\u003c\/ul\u003e\u003cp\u003e\u003c\/p\u003e\n\n\u003cbr\u003e\u003cbr\u003eReview(s):\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eEAN: 9780071741958\u003cbr\u003e\u003cbr\u003eAge Group:  \u003cbr\u003e\u003cbr\u003eNumber of Pages: 544\u003cbr\u003e\u003cbr\u003eWeight: 890.4 gr\u003cbr\u003e\u003cbr\u003e","brand":"McGraw Hill","offers":[{"title":"Hardback","offer_id":43845753766126,"sku":"9780071741958","price":223.45,"currency_code":"AUD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0630\/9612\/7726\/products\/3D-IC-Stacking-Technology-Book-Land-AU-756.jpg?v=1679296388","url":"https:\/\/bookland.com.au\/products\/9780071741958","provider":"Book Land AU","version":"1.0","type":"link"}